| 摘要 |
The invention relates to an ultrasonic wire bonding device comprising a bonding head (1) which can be displaced in a Z direction and which can be rotated. An ultrasonic transducer (4) provided with an allocated bonding tool (5) and an ultrasonic vibration generator (6) is fixed to said bonding head by means of a transducer holding fixture (3). The transducer holding fixture (3) is configured as a parallel guide which is elastic in a Z direction and which is articulated at four points. A drive device (21) is provided between the bonding head (1) and the transducer holding fixture (3) in order to displace the transducer holding fixture (3), relative to the bonding head (1), in a Z direction. The invention enables the creation of an ultrasonic wire bonding device which is equipped with a transducer holding fixture and which comprises a particularly simple construction, can be economically manufactured, and can be easily and quickly installed. According to the invention, the transducer holding fixture (3) is worked from a piece and comprises a clamping device (7) for the ultrasonic transducer (4), a fixing block (8) for fixing the transducer holding fixture (3) to the bonding head (1) and has solid body joints (11). |
