发明名称 Method of making dynamic memory device with increased charge retention capacity
摘要 A semiconductor device includes a gate electrode (4) on a semiconductor substrate (1) of one conductivity type with a gate insulating film (3); first and second diffusion regions (5, 10) of another conductivity type; and a contact hole (17) for electrically connecting one (first) (10) of the first and second diffusion regions (5, 10) to a lower electrode (8) of a cell capacitor for storing charge therein, and when a reverse voltage Vrev is applied as a junction application voltage between semiconductors of different conductivity types of the first diffusion region (10) and substrate (1), a leakage current Ileak flows between the first diffusion region (10) and substrate (1), and Vrev when the leakage current Ileak is(where a charge storage capacitance in the cell capacitor is Cs, a voltage applied to a data line (12) connected to the other (second) (5) of the first and second diffusion regions (5, 10) is Vbit, a target charge retention time is T and an area of the first diffusion region (10) is S) is three times or higher than the voltage Vbit applied to the data line (12) at room temperature.
申请公布号 US6303428(B1) 申请公布日期 2001.10.16
申请号 US20000631405 申请日期 2000.08.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 AKAMATSU SUSUMU
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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