| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for cutting a resin film on a rigid plate capable of obtaining a uniform shape of the resin film after cutting and automatically operating. SOLUTION: A device for cutting and peeling a film includes a rotary cutter provided with a pressure adjusting mechanism in cutting a film, a device for peeling a film, a device for collecting a peeled film, a position sensor, and a carrying line.
|
