| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which has good heat resistance, scarcely changes thermal expansion coefficient and elastic modulus at high temperature, and hardly causes cracks and peeling, and to provide a method for producing the same. SOLUTION: This heat-resistant resin composition characterized by comprising an organic silicon compound obtained by thermally treating a mixture of a polyamic acid, an organic silicon compound having a functional group capable of addition-reacting to NH groups and/or COOH groups in the polyamic acid, and water.
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