发明名称 |
Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
摘要 |
A composition useful as underfill sealant for the connection of a semiconductor device to a circuit board is reworkable for more easy separation from the semiconductor device and comprises a curable resin having at least one oxirane or thiirane linkage substituted on at least three of the oxirane or thiirane carbon atoms with an alkyl, alkenyl or aryl substituent along with a curing agent selected from anhydrides, amines, amides, imidazoles, and combinations thereof. |
申请公布号 |
AU4754101(A) |
申请公布日期 |
2001.10.15 |
申请号 |
AU20010047541 |
申请日期 |
2001.03.27 |
申请人 |
LOCTITE CORPORATION;ERIN K. YAEGER |
发明人 |
PHILIP T KLEMARCZYK;ANDREW D. MESSANA;AFRANIO TORRES-FILHO;TAKAHISA DOBA |
分类号 |
C07D301/14;C07D303/28;C07D493/08;C08G59/18;C08G59/20;C08G75/08;C08L63/00;H01L21/56;H01L21/60 |
主分类号 |
C07D301/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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