| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction in size and height of a wiring board and to provide a wiring board comprising a plurality of signal wirings which are formed between the same insulating layers and have different characteristic impedances. SOLUTION: This wiring board comprises a plurality of insulating layers 8, 8 between a first grounded conductor layer 2 and a second grounded conductor layer 3, and further comprises a plurality of signal wirings arranged between the insulating layers 8, 8. The plurality of signal wirings include at least a first signal wiring 4 having a first characteristic impedance and a second signal wiring 5 having a second characteristic impedance which is larger than the first characteristic impedance. The first signal wiring 4 and the second signal wiring 5 are formed between the same insulating layers. A region 7 where a grounded conductor layer is not formed is arranged at least in the part of the second grounded conductor layer 3 which corresponds to the second signal wiring 5. |
