发明名称 SEMICONDUCTOR LASER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor laser module which can effectively dissipate heat generated from a semiconductor laser element by using a constitution of low cost. SOLUTION: A heat sink 121 for conducting heat generated from the semiconductor laser element 22 to a Peltier module 20 is provided with a first layer 121a which is positioned just below the semiconductor laser element 22 and reaches the Peltier module 20, and a second layer 121b whose thermal conductivity in the heat exhaust direction (Z direction) is lower than that of the first layer 121a, and thermal conductivity in the direction perpendicular to the heat exhaust direction is at least that of the first layer 121a and which is positioned in the direction perpendicular to the heat exhaust direction to the first layer 121a.
申请公布号 JP2001284701(A) 申请公布日期 2001.10.12
申请号 JP20000097871 申请日期 2000.03.30
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 NAGAMATSU SHINYA;TANAKA SHUICHI;NAKAMURA YOSHIO
分类号 H01S5/024;H01L35/30;H01S5/022;(IPC1-7):H01S5/024 主分类号 H01S5/024
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