BONDING PASTE TRANSFER DEVICE, AND TRANSFER METHOD

摘要

PROBLEM TO BE SOLVED: To provide a bonding paste transfer device which can transfer bonding paste to a work without nonconformity by stabilizing the amount of application, and to provide a transfer method. SOLUTION: In a bonding paste transfer device which transfers the bonding paste 7 in a paste supplier to the surface of a work, a plurality of island parts 22a to which bonding paste 7 adhere at transfer operation are made in lattice- form arrangement at the bottom face of a transfer pin 22. The widthwise dimensions B1 and B2 of the island part 22a and the intervals (widthwise dimension of a slit part 22b) D1 and D2, which separate the island parts 22a from each other are set to 0.5 mm or under. They are set so that ratios (B1/D1 and B2/D2) of the intervals D1 and D2 of the island-like part with respect to the widthwise dimensions B1 and B2 reach values in the range of 1/1.5 to 1.5. As a result, bonding paste can be applied equally within an application range, by eliminating the dispersion of the bonding paste adhering to the transfer pin 22.