| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a structure that when a power device element, such as an FET, is mounted on a conducting layer for mounting provided on a resin substrate, a semiconductor package is never used for mounting the device element, the substrate is not deteriorated due to heat at the time of the mounting of the device element on the conducting layer and the separation of the semiconductor element from the conducting layer is also never generated. SOLUTION: A semiconductor device is characterized in that a metal plate is adhered to the rear of a semiconductor element with a first solder and a conducting layer for mounting provided on a resin substrate is adhered to the metal plate with a second solder. |
