MANUFACTURING METHOD OF HEAT DISSIPATION BOARD

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of heat dissipation boards, which can prevent the generation of a defect in the heat dissipation boards due to a graphite generated accompanied by a laser irradiation. SOLUTION: This method is the manufacturing method of heat dissipation boards 9 which are respectively provided with a semiconductor element and grooves 4 are formed in the surface of a diamond board 1. A first intermediate layer 2 is formed on the surface of the board 1 formed with the grooves 4. On the layer 2, a second intermediate layer 5 is formed on the regions other than the regions which are positioned on the grooves 4. A metal bonding layer 8 is formed on the layer 5. After a process to form the layer 8, the diamond board 1 is split into the heat dissipation boards 9 by pressurizing the diamond board 1 along the grooves 4.