| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a two-dimensional waveform structure which provides a substrate covered by an HSQ layer. SOLUTION: A method includes E-beam curing treatment on the HSQ layer in which a path hole should be formed. Furthermore, it includes photolithography and etching treatment on the HSQ to form a groove. As the E-beam cured HSQ layer and a heat cured HSQ layer have high selectivity coefficient for etching, an uncured HSQ layer with E-beam is treated with wet etching to form a path hole. The two-dimensional waveform structure is formed after the groove and the path hole are filled with an electroconductive substance, and either the path hole or the groove is formed at first.
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