发明名称 POWER GENERATING MECHANISM AND COMPUTER DEVICE AND ELECTRONIC EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a power generating mechanism for efficiently converting the heat energy of a heating part formed in electronic equipment into electric energy. SOLUTION: In a power generating mechanism 40, a heat sink 42 of a CPU cooler 2C is mounted on a CPU 20 of a note-sized PC 10 so that heat generated by the CPU 20 can be radiated, and that component cooling can be realized. A Seebeck element module 60A is mounted on the heat sink 42 so that a large temperature difference can be applied with the heat emitted from the heat sink 42 and the cooling accompanied with the blast of a fan unit 44. Thus, an electromotive force to be obtained from the Seebeck element module 60A can be increased.</p>
申请公布号 JP2001282396(A) 申请公布日期 2001.10.12
申请号 JP20000084839 申请日期 2000.03.24
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 MAEDA KAZUHIKO;HORIKOSHI HIDETO
分类号 F28D15/02;G06F1/20;G06F1/26;H01L35/00;H02N11/00;(IPC1-7):G06F1/26 主分类号 F28D15/02
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