摘要 |
A capacitor array device (19) is described including a multiple capacitor chip for mounting upon an electronic circuit board. The device includes a device body defined by a plurality of dielectric layers and conductive layers (27-30, 39-41 a-b) arranged in a stack to form a number of adjacent capacitors. Barium titanate may be employed as a dielectric. The capacitor array device includes a plurality of terminal structures electrically connected to the electrode plates. The device typically includes a sintered body of a multilayer ceramic material in which multiple electrode layers are stacked with dielectric layers being located between the electrode layers. Multiple combinations of capacitance values may be used within the array. An array having two, three, four, five, six, or more capacitors may be constructed, such that certain of the capacitors have about the same capacitance value, while other capacitors within the array have other different capacitance values. The capacitance values among the adjacent capacitors within the array may differ by ratios as high as 1:100 or more.
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