发明名称 |
Wiring substrate, method of manufacturing the same and semiconductor device |
摘要 |
A wiring substrate equipped with a rerouted wiring having one end connected to an electronic-part mounting pad for electrically connecting an electronic part and another end connected to an external-connection terminal. In the wiring substrate, a low-elasticity underlayer made of a material having a lower modulus of elasticity than that of a base material of the wiring substrate is disposed between the base material of the wiring substrate and each of the electronic-part mounting pad and the rerouted wiring. A method of manufacturing the wiring substrate and a semiconductor device using the wiring substrate are also disclosed.
|
申请公布号 |
US2001027874(A1) |
申请公布日期 |
2001.10.11 |
申请号 |
US20010826512 |
申请日期 |
2001.04.05 |
申请人 |
HORIUCHI MICHIO;KURIHARA TAKASHI |
发明人 |
HORIUCHI MICHIO;KURIHARA TAKASHI |
分类号 |
H05K3/28;H01L23/12;H01L23/14;H01L23/373;H01L23/498;H05K1/02;H05K1/11;H05K3/34;H05K3/46;(IPC1-7):H05K1/03;B32B7/02 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|