| 摘要 |
<p>According to the invention, a microperforation (PMP) process step is combined with the lamination process. To this end, a dielectric layer (11,11') and a prefabricated product (1) are placed between two perforation dies (21,23) or a support and a perforation die. The prefabricated product (1) is partially covered by a conducting layer forming structures to be contacted by microvias. Pressure is applied on the perforation die (21,22), perforation tips of the perforation dies forming microvias for contacting the structures. A surface of the dielectric layer (11,11') or the prefabricated product (1) is configurated or coated to in a manner that the prefabricated product (1) and the dielectric layer (11,11') stick to each other after the pressure has been applied.</p> |
