| 摘要 |
<p>A metallized polyimide film comprising a polyimide film (1) which has been subjected to surface-roughening treatment so as to have a Ra value of 2 to 10 nm, an intermediate layer (2) which is formed on the surface having been subjected to surface-roughening treatment, comprises one or two selected from among molybdenum, silicon, and silicon monoxide, and has an average thickness of 5 to 50 % of the Ra value of the surface and, formed on the intermediate layer (2), a metal layer (4) having electrical conductivity. The metallized polyimide film exhibits an improved jointing strength between a polyimide film and a metal layer.</p> |
