| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability and molding property, and a semiconductor device in which a semiconductor element is sealed by the above composition. SOLUTION: This epoxy resin composition consisting of (A) an epoxy resin, (B) a curing agent and (C) a filler is characterized by having the following characteristic shown by (1) in its melt viscosity curve by a flow tester. (1) On setting a point showing the lowest melt viscosity as a point (a), a point at 5 sec after the point (a) as a point (b) and a straight line connecting the points (a) with (b) as the straight line (ab), the slope of the straight line (ab) is <=3.5.
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