| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curable resin composition capable of producing an insulator excellent in thermal shock resistance and dielectric characteristics. SOLUTION: This curable resin composition comprises (A) a resin bearing at least two crosslinkable functional groups in the molecule and (B) a low molecular weight compound bearing at least two crosslinkable functional groups of the same kind as those in (A), the weight-average mol.wt. of (A) being 3,000-1,000,000 and the weight-average mol.wt. of (B) being 170-3,000, and gives after cure a dielectric constant of not more than 3.5.
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