Apparatus and method for removing a polishing pad from a platen

摘要

An apparatus and method for removing a polishing pad from a platen during a CMP process is disclosed. The invention facilitates the removal of a polishing pad from a platen by providing a polishing pad having at least one protuberance portion extending from the main portion of the pad such that the polishing pad may be removed manually or with the assistance of a device by engaging the protuberance portion.