发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To suppress generation of a scratch in a polished surface, by reducing concentration of rough grains in an abrasive grain dispersed fluid by containing it. SOLUTION: This polishing method, applying polishing while supplying an abrasive grain dispersed fluid containing it, is characterized by polishing while supplying the above abrasive grain dispersed fluid dispersion treated by a high pressure homogenizer and/or ultrasonic homogenizer.</p>
申请公布号 JP2001277106(A) 申请公布日期 2001.10.09
申请号 JP20000092010 申请日期 2000.03.29
申请人 TOKUYAMA CORP 发明人 KATO HIROSHI;HAYASHI KAZUHIKO
分类号 B24B57/02;B24B37/00;H01L21/304;(IPC1-7):B24B37/00 主分类号 B24B57/02
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