发明名称 Photosensitive polymers and chemically amplified photoresist compositions using the same
摘要 The compounds are of a class of photosensitive polymers for use in chemically amplified photoresists. These photoresists produce sharp line patterns when exposed with an ArF excimer laser. The polymer composition includes a copolymer and the photoresist composition includes a terpolymer with a photo acid generator. The resulting chemically amplified photoresist compositions have strong resistance to dry etching, possess excellent adhesion to film material, and are capable of being developed using conventional developers.
申请公布号 US6300036(B1) 申请公布日期 2001.10.09
申请号 US19980203669 申请日期 1998.12.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI SANG-JUN;KANG YOOL;JUNG DONG-WON;PARK CHUN-GEUN
分类号 C08F220/12;C08F220/18;C08F220/28;C08F222/06;C08F232/08;C08G61/08;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):B03F7/004 主分类号 C08F220/12
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