发明名称 |
Photosensitive polymers and chemically amplified photoresist compositions using the same |
摘要 |
The compounds are of a class of photosensitive polymers for use in chemically amplified photoresists. These photoresists produce sharp line patterns when exposed with an ArF excimer laser. The polymer composition includes a copolymer and the photoresist composition includes a terpolymer with a photo acid generator. The resulting chemically amplified photoresist compositions have strong resistance to dry etching, possess excellent adhesion to film material, and are capable of being developed using conventional developers.
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申请公布号 |
US6300036(B1) |
申请公布日期 |
2001.10.09 |
申请号 |
US19980203669 |
申请日期 |
1998.12.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI SANG-JUN;KANG YOOL;JUNG DONG-WON;PARK CHUN-GEUN |
分类号 |
C08F220/12;C08F220/18;C08F220/28;C08F222/06;C08F232/08;C08G61/08;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):B03F7/004 |
主分类号 |
C08F220/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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