| 摘要 |
An electronic assembly is described herein having a first semiconductor integrated circuit substrate with circuitry disposed thereon. This semiconductor integrated circuit substrate is coupled with a package through a first plurality of electrical connections. Sandwiched between portions of the semiconductor integrated circuit substrate and the package is an electronic assembly which is coupled to the semiconductor substrate circuitry and also the package through low resistance, low inductance connections. An electronic subassembly is described which includes a second semiconductor substrate having circuitry disposed thereon, the circuitry forming one or more of a capacitor, a charge pump, or a voltage regulator. Insulating material is disposed over the circuitry, and vias are formed therethrough. Metal bands are disposed to be continuous around the outside of the subassembly, thereby also forming a connection with the second semiconductor circuitry. The electronic subassembly metal bands then make connections with the circuitry of the semiconductor integrated circuit substrate and the package.
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