发明名称 LASER PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser processing apparatus having a coaxial laser processing head in which an arc can be securely stabilized, and the head is small-sized, in no danger of harming any optical instruments and inexpensive, in the case of performing both of a laser welding and an arc welding at the same time. SOLUTION: An electric arc discharge is performed from GMA electrode after or at the same time when starting an oscillation of laser beam from YAG laser oscillator. Further, the oscillation of laser beam from YAG laser oscillator is controlled to stop after or at the same time when stopping the electric arc discharge from GMA electrode. The coaxial laser processing head is also constructed to arrange the GMA electrode coaxially with the same laser beam in a space portion of a first and second divided laser beams which are respectively divided into halves by a first and second reflecting mirrors, or the coaxial laser processing head is constructed to arrange GMA electrode coaxially with a main body of the laser beam in a space portion which is formed in the main body of the laser beam by taking a part of the laser beam outside by the first and second reflecting mirrors.</p>
申请公布号 JP2001276988(A) 申请公布日期 2001.10.09
申请号 JP20000093599 申请日期 2000.03.30
申请人 MITSUBISHI HEAVY IND LTD 发明人 AKAHA TAKASHI;NAGASHIMA TADASHI;ISHIDE TAKASHI;TSUBOTA SHUHO
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/08;B23K26/14;B23K26/20;(IPC1-7):B23K26/00 主分类号 B23K26/00
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