发明名称 Substrate polishing article
摘要 A polishing layer for chemical mechanical polishing includes a frozen binder material solution which has a liquid state at room temperature, and solid particles dispersed in the frozen binder material. The solid particles may be abrasives, such as colloidal silica or alumina, and/or non-reactive particles, such as pieces of polyurethane or polymerized resins. The polishing layer can also include a chemical etchant. The frozen polishing pad can be formed and reconditioned in situ.
申请公布号 US6299516(B1) 申请公布日期 2001.10.09
申请号 US19990407002 申请日期 1999.09.28
申请人 APPLIED MATERIALS, INC. 发明人 TOLLES ROBERT D.
分类号 B24B37/04;B24B53/02;B24B55/02;B24D7/18;(IPC1-7):B24B29/00 主分类号 B24B37/04
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