| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection conductor for semiconductor packages, semiconductor packages, and the assembly method of the semiconductor packages, that can greatly reduce the contact resistance between a metal electrode on a pellet, such an an Al electrode and a connection conductor connected to the metal electrode, and reduce packaging cost. SOLUTION: A clip 10 is used as the connection conductor for semiconductor packages that is connected to a metal electrode 2 of a semiconductor pellet 1 and is made of a strip of copper or copper alloy foil. In this case, on a surface that is connected to the metal electrode 2, a projection 20 is formed. The projection 20 breaks an oxide film on the surface of the metal electrode 2, and a newly generated surface of the inside comes into contact with the projection 20. |
