| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which can be mounted to a thinned and small- sized electronic device, etc., having high mobility, and is superior in heat dissipating performance. SOLUTION: This heat sink comprises the members shown below; (a) a flat heat pipe into which an operating liquid is sealed and which has an airtight cavity part, and (b) a fin part which comprises a channel-shaped plate material composed of an upper face part, a vertical face part and a lower face part, and is formed in a lowermost part of the vertical face part, and in which a plurality of leaf-like fins having a channel-shaped opening part into which the flat heat pipe is fitted are disposed in parallel to each other.
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