| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a BGA packaging socket structure which is structured simple and thin and which is superior in the reliability and durability. SOLUTION: This is installed with a plurality of metal blades 4 formed by metal plates 3 in a contact part 2 and constituted so that a side part of each metal blade 4 is brought into contact with a solder ball 3. This metal blade 4 is notched in the vicinity of the center of a circular metal plate 3 and the notched part has been erected upright by folding. The metal blade 4 obtains a predetermined spring property in this notched and erected shape. The periphery of this notched part is also set slanted, lower in the central part and higher in the outer circumferential part. Further, each metal blade 4 is arranged to have the same angle.</p> |
