发明名称 TREATING SYSTEM AND INTERFACE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a treating system which can more increase the number of substrates which are flowed within a treating system, and to provide an interface device. SOLUTION: Each of buffer cassettes (BC1 and BC2) is constituted so as to be able to house a multitude of substrates, such as 20 sheets or thereabouts of substrates, in the vertical directions and is constituted so as to be able to once house both of the substrates delivered from the side of a third process part 6 via a second subarm mechanism 46 and the substrates delivered from the side of an aligner 2 via the second subarm mechanism 46.
申请公布号 JP2001274057(A) 申请公布日期 2001.10.05
申请号 JP20000084875 申请日期 2000.03.24
申请人 TOKYO ELECTRON LTD 发明人 TAGAMI SHINYA
分类号 H05K3/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05K3/00
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