| 摘要 |
PROBLEM TO BE SOLVED: To appropriately clean a wafer without causing damages due to ejection of cleaning liquid. SOLUTION: A wafer 30 for detecting damages is prepared by forming a resist film 31 for detecting damages on a wafer. The wafer 30 for detecting damages is then given damages by ejecting cleaning liquid 16 from a nozzle 13. Number of damages 32, formed on the resist film 31, is then detected by means of a damage detector 20. Based on the difference between the detection value and the reference value of the damages, the current level of a megasonic oscillation mechanism in the nozzle 13 of a wafer cleaner 10 is adjusted. The wafer 1 is then cleaned by ejecting the cleaning liquid 16 from the nozzle 13 onto an actual wafer 1. Since the wafer can be cleaned without causing damages, quality and reliability of cleaning can be enhanced.
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