发明名称 |
Connecting device for power semiconductor modules with compensation for mechanical stresses |
摘要 |
A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the sleeve during operation to form an electrical connection for a board. The wire pin has a diameter greater than the given diameter for clamping the wire pin upon insertion in the region. Axial freedom of movement of the wire pin in the sleeve makes it possible to avoid mechanical stresses resulting from different material characteristics when a temperature change takes place.
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申请公布号 |
US2001025964(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20010793793 |
申请日期 |
2001.02.26 |
申请人 |
LODDENKOTTER MANFRED;STOLZE THILO |
发明人 |
LODDENKOTTER MANFRED;STOLZE THILO |
分类号 |
H01L23/32;H01L23/051;H01L23/055;H01L23/16;H01L23/433;H01L23/495;H01L23/498;H01L25/00;H01L29/74;H01R13/52;H01R43/02;H05K3/34;H05K3/40;H05K7/10;(IPC1-7):H01L29/74;H01L31/111;H01L23/48;H01L23/52 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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