| 摘要 |
<p>A photocurable/thermosetting resin composition which comprises (A) a photosensitive prepolymer having both at least one carboxyl group and at least two ethylenically unsaturated double bonds per molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups per molecule, and (E) a curing accelerator. It is alkali-developable, and can be formulated so as to be of the one-pack type. This composition and a photosensitive dry film formed therefrom are useful as various resist materials and insulating materials, in particular, a solder resist for printed circuit boards, an interlayer dielectric for build-up multilayered printed circuit boards, etc.</p> |
