| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in a method for cleaning the surface in which the inside and bottom of a hole with a diameter of micron or less consisting of copper or almost of copper, a combination of a treatment in which a vapor phase treatment using expensive chemicals and a liquid phase treatment is necessary, and extremely long handling time and high cost have been required for it. SOLUTION: For cleaning vapor, above treatments water and acetic acid vapor are used, and only with combination of the treatment in a vapor phase, the removal, i.e., the cleaning of organic impurities adhered on the surface having a fine structure is attained.
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