发明名称 COMPOSITE OF EPOXY RESIN AND INORGANIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a composite of an epoxy resin and an inorganic component, having an improved glass transition temperature, a low coefficient of thermal expansion and a good modulus, and its manufacturing method. SOLUTION: The composite of an epoxy resin and an inorganic component comprises a cured epoxy resin which consists of an epoxy resin as component (a), a curing agent as component (b), and a silicone alkoxide as component (c). A primary reaction product, is obtained by previous ring opening polymerization of the epoxy resin in an atmosphere having substantially no water content and then complete curing of the epoxy resin is achieved by supplying water to the primary product to progress the hydrolysis and condensation reaction of the silicone alkoxide simultaneously.
申请公布号 JP2001270979(A) 申请公布日期 2001.10.02
申请号 JP20000088050 申请日期 2000.03.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YODA HIROYOSHI
分类号 C08L63/00;C08G59/40;C08K3/34;(IPC1-7):C08L63/00 主分类号 C08L63/00
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