发明名称 |
Processing low dielectric constant materials for high speed electronics |
摘要 |
A low dielectric constant printed circuit board includes: a low dielectric constant porous polymer layer having holes therethrough, the porous layer having pores; and a patterned metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes, the patterned metallization layer not significantly protruding into the pores of the porous layer.
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申请公布号 |
US6297459(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19980019304 |
申请日期 |
1998.02.05 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WOJNAROWSKI ROBERT JOHN;COLE HERBERT STANLEY;SITNIK-NIETERS THERESA ANN;DAUM WOLFGANG |
分类号 |
H05K1/02;H05K1/09;H05K3/38;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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