发明名称 METHOD FOR INSPECTING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an inspection method with such high precision that a minute contaminant, etc. an can be detected and so that an inspection time is set to be short in the inspection of substrate wiring patterns and through holes. SOLUTION: The radially outward distance from a base point 20 to a point deviating from a through hole is measured and its is decided whether or not the radius or diameter of the through hole is in an allowable range for each inspection direction. For example, when the inspection is made by the radius of the through hole, when a contaminant, etc., is absent in a scanning line like in the directions of arrow 3 and the shape of the peripheral part of a through hole 13 is normal, it is decided normal because the transformed distance is equal to the formal radius of the through hole registered previously. When a contaminant 15 is present is the scanning line like in the direction of a arrow 5 since the measured radius of the through hole is shorter than the formal radius of the through hole, it is decided that an inspected substrate is a failure. Accordingly, since the minute contaminant, etc., can be detected, the precision is high and an inspection time is shortened.
申请公布号 JP2001267722(A) 申请公布日期 2001.09.28
申请号 JP20000081490 申请日期 2000.03.23
申请人 NGK SPARK PLUG CO LTD;TAKANO CO LTD 发明人 NAGASAKI MASATO;TSUNEKAWA TOMOYOSHI;IWAMATSU EIJI;ODAGIRI AKIRA
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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