CAPACITOR-INCORPORATING SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a capacitor-incorporating substrate, which has high productivity and can have its circuit board made small-sized and contribute to an increase in the speed of a digital circuit, and to provide its manufacturing method. SOLUTION: After a dielectric film 2 of acrylic resin is formed by an electrophoresis on the roughened surface of copper foil 1, an aluminum layer 3 is formed at a specific position on the dielectric film 2 to complete a thin capacitor, which is thermocompression bonded by compression to an insulating substrate 4 provided with an interstitial via hole 5 filled with copper paste 6 in advance, so that the capacitor incorporated substrate can be manufactured which can shorten the wiring distance between the capacitor and a CPU and make circuit board small-sized.