发明名称 METHOD OF MANUFACTURING GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR AND GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a group III nitride-based compound semiconductor in which through dislocations are suppressed. SOLUTION: Steps of a first group III nitride-based compound semiconductor layer 31 are formed by etching in a shape of islands, such as point-shaped, stripe-shaped or lattice-shaped, so that a layer this is different from the first group III nitride-based compound semiconductor layer 31 is exposed in the bottom parts of the steps. A second group III nitride-based compound semiconductor 32 is grown by transverse epitaxy to bury the stepped parts, and can also be grown upward thereafter, wherein the upper face of the upper steps and the side faces of the steps are utilized as the nuclei for the growth. In this occasion, upper section of the second group III nitride-based compound semiconductor 32 grown by transverse epitaxy can be a region where propagation of the through dislocations that are present in the first group III nitride- based compound semiconductor layer 31 is suppressed.
申请公布号 JP2001267243(A) 申请公布日期 2001.09.28
申请号 JP20000071351 申请日期 2000.03.14
申请人 TOYODA GOSEI CO LTD 发明人 KOIKE MASAYOSHI;TEZENI YUUTA;YAMASHITA HIROSHI;NAGAI SEIJI
分类号 H01L21/205;H01L33/06;H01L33/12;H01L33/32;H01L33/34;H01S5/323;H01S5/343 主分类号 H01L21/205
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