发明名称 CONTACT STRUCTURE OF WIRING AND ITS MANUFACTURING METHOD AND THIN-FILM TRANSISTOR SUBSTRATE CONTAINING CONTACT STRUCTURE OF WIRING AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide the contact structure of wiring that is made of a low- resistance material and at the same time has low-resistance contact characteristics, its formation method, a thin-film transistor substrate that includes the contact structure of wiring having the excellent contact characteristics, and its manufacturing method, and to simplify the manufacturing method of the transistor substrate. SOLUTION: This method for forming the contact structure of the wiring includes a step that forms the wiring by metal at the upper part of the substrate, a step that laminates an inorganic insulating film for covering the wiring, a step that performs a heat treatment process, a step that allows the inorganic insulating film to be subjected to patterning to form a contact hole for exposing the wiring, and a step that forms a conductive layer that is electrically interlocked to the wiring.</p>
申请公布号 JP2001267420(A) 申请公布日期 2001.09.28
申请号 JP20010001118 申请日期 2001.01.09
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RYU SHUNKI
分类号 G02F1/1368;G02F1/1345;G02F1/1362;G09F9/30;H01L21/3205;H01L21/336;H01L21/768;H01L21/77;H01L21/84;H01L23/52;H01L29/45;H01L29/786;(IPC1-7):H01L21/768;G02F1/136;H01L21/320 主分类号 G02F1/1368
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