APPARATUS AND METHOD FOR FORMING COATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a coating film forming apparatus by which setting for obtaining a desired thickness of a coating film can be easily and accurately performed. SOLUTION: The coating film forming apparatus which supplies a wafer W with a resist fluid and rotates the wafer W for diffusing the resist fluid by the centrifugal force of the rotation and for forming a coating film has a control section 311 for setting the rotation speed. The control section 311 has a target film thickness input section 312 for setting the target film thickness of the resist film, a film thickness-number of revolution correlation storing section 315 for storing the correlation between the number of revolution and the thickness of the coating film obtained from it, and a number of revolution calculating section 320 for applying the target film thickness set by the film thickness input section 312 to the correlation stored in the film thickness-number of revolution correlation storage section 315 and for calculating the number of revolution for obtaining the target film thickness on the basis of the application.