发明名称 |
Circuit board has connecting pads with upper sides arranged in planes which are at the height of and/or above the plane of the upper side of the conducting pathways |
摘要 |
Circuit board comprises a support plate (12) having a conductive pattern with conducting pathways (24) and connecting pads (20) for soldering to contact elements of electrical/electronic components. The upper side of one of the connecting pads is arranged in planes which are at the height of and/or above the plane of the upper side of the conducting pathways. An Independent claim is also included for a process for the production of the circuit board. Preferred Features: The upper sides of the connecting pads and/or the conducting pathways and/or their regions are arranged in several different planes.
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申请公布号 |
DE10013483(A1) |
申请公布日期 |
2001.09.27 |
申请号 |
DE20001013483 |
申请日期 |
2000.03.18 |
申请人 |
EIDENBERG, KASPAR |
发明人 |
EIDENBERG, KASPAR |
分类号 |
H05K1/02;H05K3/06;H05K3/10;H05K3/12;H05K3/24;H05K3/34;(IPC1-7):H05K3/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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