发明名称 |
PLASMA TREATMENT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment method which is capable of assuring good treatment quality by suppressing the reoxididation after a plasma treatment. SOLUTION: In the plasma treatment method for removing the oxidized films on electrode surfaces by subjecting a substrate formed with the electrodes consisting of copper or copper alloy to the plasma treatment, the substrate is subjected to the plasma treatment by using plasma-generating gas containing gaseous hydrogen which is reducing gas and thereafter the substrate is rested for a prescribed time and is subjected to aging to cool the substrate to ordinary temperature while the supply of the plasma-generating gas is continued. As a result, the direct contact of the cleaned surface right after the plasma treatment with oxygen is prevented and the progression of the reoxidation may be suppressed. |
申请公布号 |
JP2001262378(A) |
申请公布日期 |
2001.09.26 |
申请号 |
JP20000073828 |
申请日期 |
2000.03.16 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
FURUKAWA RYOTA;HAJI HIROSHI |
分类号 |
H05H1/46;B01J19/08;C23F4/00;H01L21/302;H01L21/3065;H01L21/60;H05K3/32 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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