发明名称 PLASMA TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment method which is capable of assuring good treatment quality by suppressing the reoxididation after a plasma treatment. SOLUTION: In the plasma treatment method for removing the oxidized films on electrode surfaces by subjecting a substrate formed with the electrodes consisting of copper or copper alloy to the plasma treatment, the substrate is subjected to the plasma treatment by using plasma-generating gas containing gaseous hydrogen which is reducing gas and thereafter the substrate is rested for a prescribed time and is subjected to aging to cool the substrate to ordinary temperature while the supply of the plasma-generating gas is continued. As a result, the direct contact of the cleaned surface right after the plasma treatment with oxygen is prevented and the progression of the reoxidation may be suppressed.
申请公布号 JP2001262378(A) 申请公布日期 2001.09.26
申请号 JP20000073828 申请日期 2000.03.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FURUKAWA RYOTA;HAJI HIROSHI
分类号 H05H1/46;B01J19/08;C23F4/00;H01L21/302;H01L21/3065;H01L21/60;H05K3/32 主分类号 H05H1/46
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