| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-pack type epoxy resin composition that is a liquid type sealing material for semiconductor connecting having a low viscosity without impairing the workability and gives semiconductor packages of high reliability since it gives cured products of reduced shrinkage stress and reduced thermal stress. SOLUTION: The objective liquid resin composition for sealing comprises, as essential components, (A) an epoxy resin, (B) a curing agent for the epoxy resin, (C) the polymer particles, as a stress relaxant, having a 2 or more layer structure that is prepared by coating a low-elastic polymer as a core material with a glass-like polymer on the surface, for example, the core part is an acrylic ester polymer, the coated parts are methyl methacrylate and the particle size is 0.5μm, (D) fillers, (E) a curing accelerator and (F) a coupling agent.
|
