发明名称 Structure and method for improved latch-up using dual depth STI with impurity implant
摘要 A method and structure for improving the latch-up characteristic of semiconductor devices is provided. A dual depth STI is used to isolate the wells from each other. The trench has a first substantially horizontal surface at a first depth and a second substantially horizontal surface at a second depth which is deeper than the first depth. The n- and p-wells are formed on either side of the trench. A highly doped region is formed in the substrate underneath the second substantially horizontal surface of the trench. The highly doped region abuts both the first and the second wells and extends the isolation of the trench.
申请公布号 US6294419(B1) 申请公布日期 2001.09.25
申请号 US20000705882 申请日期 2000.11.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BROWN JEFFREY SCOTT;GAUTHIER, JR. ROBERT J.;MANN RANDY WILLIAM;VOLDMAN STEVEN HOWARD
分类号 H01L21/76;H01L21/762;H01L21/8238;H01L27/08;H01L27/092;(IPC1-7):H01L21/823;H01L21/336 主分类号 H01L21/76
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