发明名称 |
Method for making a flexible circuit interposer having high-aspect ratio conductors |
摘要 |
A low-modulus-of-elasticity flexible adhesive interposer substrate has high aspect ratio via conductors to which an electronic device, such as a semiconductor chip or die or other component, is attached, e.g., for a high density electronic package. A method for making the flexible adhesive interposer substrate includes etching a sheet of metal to form the high aspect ratio via conductors which are held in position by a sheet or layer of a molecularly flexible adhesive. The via conductors may be built up to even greater aspect ratio. Such flexible interposer may include high aspect ratio via conductors for a plurality of similar or different electronic devices. |
申请公布号 |
AU4550001(A) |
申请公布日期 |
2001.09.24 |
申请号 |
AU20010045500 |
申请日期 |
2001.03.08 |
申请人 |
AMERASIA INTERNATIONAL TECHNOLOGY, INC.;KEVIN KWONG-TAI CHUNG |
发明人 |
KEVIN KWONG-TAI CHUNG |
分类号 |
H01L23/055;H01L23/498;H01L23/538;H01L25/065;H01Q1/22;H01Q1/36;H01Q1/38;H01Q7/00;H01Q23/00;H01R13/24;H01R43/00;H05K3/40 |
主分类号 |
H01L23/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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