| 摘要 |
PROBLEM TO BE SOLVED: To prevent the reliability of a connection from dropping remarkably. SOLUTION: This soldering method prevents a large temperature gradient from being made within a solder connection, by lessening the heat capacity of the part main body for making it hard for the precipitation of a component of low melting point hard to occur on the side close to a board, putting heat insulating material between the leads of a part and the main body of the part, or performing cooling of a second face by cold air, water or the like and the heating the periphery of the electronic part main body at the first face with hot air or water, when performing flow soldering, using the Pb free solder of higher melting point then conventional Sn-37 mass % Pb or noneutectic composition. |
