| 摘要 |
PURPOSE: A stacked BLP package and a method for manufacturing the same are provided to emit efficiently the heat generated from a package by installing a heat-sink on a semiconductor chip. CONSTITUTION: A multitude of chip pad(21a) is adhered to a semiconductor chip(21). A lead frame(22) for forming a lower lead(22a) and an upper lead(22b) is installed on the chip pads(21a). The lead frame(22) is connected electrically with the semiconductor chip(21) by a metal wire(23). A molding portion(24) is formed to expose a bottom portion of the semiconductor chip(21), a bottom portion of the lower lead(22a), and an upper portion of the upper lead(22b). A solder ball(24) is adhered to a bottom portion of the lower lead(22a). An epoxy(26) is formed on upper lead(22b). A heat-sink(27) is adhered to a bottom portion of the semiconductor chip(21). |
