| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which can manufacture a multilayer board high in wiring density without a large-scale manufacture facility such as press machines, etc. SOLUTION: Groups 4, 4,... of conductors are arranged on a wiring layer 3 made on an insulating substrate 1. Then, an insulating sheet 5 is placed on the groups 4, 4,... of the conductors, and the peripheral edges of the insulating substrate 1 and the insulating sheet 5 are sealed to form sealed space between the insulating substrate 1 and the insulating sheet 5. A vacuum system is connected to this sealed space, and this sealed space is depressurized. Atmospheric pressure presses the insulating sheet 5, and the insulating sheet 5 is sucked and stuck to the side of the insulating substrate 1. At this time, the groups 4, 4,... of the conductor bumps pierce and break through the insulating sheet 4. After hardening of the insulating sheet 5, the topside of the insulating sheet 5 is polished and smoothed, and electrolytic plating or the like is applied hereon to form a wiring layer 10. |
