发明名称 DIE BONDER
摘要 PROBLEM TO BE SOLVED: To provide a die bonder which can efficiently bond a die by preventing the breakage of a transportation pawl, etc., when a carrier jig is transported. SOLUTION: A transportation pawl section 17 is rotatably attached to a load adjusting section 15 and fixed by means of the ball B of the section 15. When the pawl section 17 is fixed, the switch section SW of a load detecting section 16 is pressed down by means of a switch pawl 17b and set in a conducted state. A transportation mechanism 10 transports a pawl 17a by pushing the pawl 17a by pressing the carrier jig KG against the rear side of the pawl 17a. When the jig KG is caught by a feeder chute section 9, an overload is applied to the pawl 17a and the ball B comes off the pawl section 17. As a result, the section 17 rotates and prevents the breakage of the pawl 17a. Simultaneously, the load detecting section 16 is turned off and this die bonder for SAW is stopped. The rotating pawl section 17 comes into collision with a rotation preventing pin 16a and the angle of rotation of the section 17 is limited. Consequently, the pawl section 17 is prevented from being caught by the chute section 9.
申请公布号 JP2001257216(A) 申请公布日期 2001.09.21
申请号 JP20000069779 申请日期 2000.03.14
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 MAKITA YOSHIAKI
分类号 H01L21/52;H01L21/50;H03H3/08;(IPC1-7):H01L21/50 主分类号 H01L21/52
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