发明名称 MULTI-SUBSTRATE CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a multi-substrate circuit device exhibiting an excellent safety from leakage while suppressing increase in costs. SOLUTION: The multi-substrate circuit device is provided with a photocoupler 313 having low-potential terminals 3131 and 3132 to which a low potential is applied, and high-potential terminals 3133 and 3134 to which a potential higher than that applied to the low-potential terminals is applied; and a low-potential side circuit board 32 mainly having low-potential conductor patterns 37 and 38 to which a low potential is applied, and a high-potential side circuit board 31 mainly having high-potential conductor patterns 39 and 40 to which a high potential is applied. The low-potential terminals 3131 and 3132 of the photocoupler 313 are fixed on the low-potential conductor patterns 37 and 38 of the low-potential side circuit board 32, and the high-potential terminals 3133 and 3134 of the photocoupler 313 are fixed on the high-potential conductor patterns 39 and 40 of the high-potential side circuit board 31.
申请公布号 JP2001257442(A) 申请公布日期 2001.09.21
申请号 JP20000068507 申请日期 2000.03.13
申请人 DENSO CORP 发明人 IINO JUNICHI
分类号 H05K1/14;H01L25/10;H01L25/18;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/14
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