SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR PACKAGE PROVIDED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent the disconnection of outer leads of semiconductor elements and reduce cost, in a semiconductor package made by stacking a plurality of the semiconductor elements on a base substrate. SOLUTION: The outer leads 28 of the semiconductor elements 23 are formed by drawing into a cylindrical shape inside outer lead holes 26. The four semiconductor elements 23 are stacked on the base substrate 21, with the outer lead holes 26 being disposed on connection terminals 22 of the base substrate 21. By filling spaces surrounded by the outer leads 28 inside the four outer lead holes 26 formed on the connection terminals 22 of the base substrate 21 with solder 33, the four semiconductor elements 23 are mounted on the base substrate 21.